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Thermal design of a sensor for building control equipped with QFN electronic devices subjected to free convection. Effects of the encapsulating resin

Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.enbuild.2017.02.022.
  • About this
    data sheet
  • Reference-ID
    10470202
  • Published on:
    27/10/2020
  • Last updated on:
    27/10/2020
 
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