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Effect of cracks on thermal stress and strain of a tape automated bonded package

Author(s):


Medium: journal article
Language(s): English
Published in: Composite Structures, , n. 1-4, v. 38
Page(s): 525-530
DOI: 10.1016/s0263-8223(97)00088-3
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/s0263-8223(97)00088-3.
  • About this
    data sheet
  • Reference-ID
    10460102
  • Published on:
    25/10/2020
  • Last updated on:
    25/10/2020
 
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